Starting of production and co-operation with Asian component suppliers do not allow Apple to keep secret specifications and appearance of new mobile devices being prepared for release.
In the case of the iPhone 5 deals with the leak from the production lines of the few internal components, including the display, the metal back panel, and now the motherboard with a new A6 processor.
The ARM Cortex-A9 (Dual-core A5 processor) in the current device has made the iPhone 4S twice productive than iPhone 4. How can Apple do with the following modification of its best-selling smartphone game? Of course, to make it faster, using A6 processors.
Rumors that the iPhone 5 will be built on a quad-core chip, are confirmed. 9to5mac published images of the iPhone 5’s motherboard, which has the A6 labeled processor. The new chipsets are expected are based on 28-nm process technology, which will affect the performance increase of the new smartphone, as well as longer battery life than iPhone 4S.
|iPhone 5 Logic Board With A6 Processor|
In addition to the motherboard on the web leaked out front panel of the iPhone 5. Nowhereelse.fr published comparative snapshots of the iPhone 4S and iPhone 5.
|iPhone 5 front panel|
And after this below is posted photo of the inside of the iPhone 5’s front panel. You can see the unknown chip is still there near the top of the device, that has been once regarded as an NFC chip.
|iPhone 5 front panel inside|
According to the presented evidence on the Web, the new iPhone will be significantly different from its predecessor, released in fall 2011. Rumors from different sources ascribe a great display of up to 4 inches, quad-core A6 cpu, internal memory up to 64 GB, 8-megapixel camera, the NFC chip, 4G LTE support and 1 GB of “RAM”. The expected iPhone 5 release date is 12th September.